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SEMIKON T-230-AS (PAI)

SEMIKON T-230-AS (PAI)

T-230-AS is an anti-static fiber reinforced Polyamide-imide polymer product with thermal stability up to 500℉. The fiber reinforcement offers high stiffness and deformation resistance up to its maximum service temperature. The product provides suppression of electrostatic charging in test sockets, nests, and fixtures in semiconductor and electronic testing equipment. The static dissipative properties, stiffness at temperature, and dimensional stability of T-230-AS makes the product ideal for electronic and semiconductor device handling components. Semikon-T-230-AS is compression molded and fully Imidized & annealed PAI product with a high degree of dimensional stability during and after machining of intricate components. The product is available in rod, tube and plate.

Semikon T-230-AS Data Sheet

Category: Semikon Series - Semi-conductor Industry Grades
Industries: Semi-conductor
Applications: CMP Polishing,Dry Process,Test Assembly Packing
Core Material: PAI
Additive: Unfilled